dma

Overview

Advanced dynamic mechanical analyzer for characterizing viscoelastic properties of polymers under various temperature and frequency conditions. Essential for understanding material behavior under dynamic loading conditions typical in sealing applications.

Example outputs

  • Measurement of Tg of Polymeric Materials

    A common measurement on polymers is the glass transition temperature, Tg. It can be measured with various techniques, but DMA is by far the most sensitive. The figure to the right shows a scan of a pressure-sensitive adhesive run in the tension clamps at a frequency of 1 Hz. Tg can be measured by the E’ onset point, by the E’’ peak, or the peak of tan δ. In addition to the Tg, the absolute value of the various viscoelastic parameters is also useful.

  • Characterizing Packaging Films Using Creep

    In a thermoforming process, a film is pulled down into a heated mold to form a desired shape. The ability to produce a stable product can be predicted by using a creep-recovery experiment. This figure illustrates data on a packaging film using the tension mode. In the recovery phase, the equilibrium recoverable compliance, (Jer ) can be calculated. If the sample compliance is too high, as observed by a high Jer , then the elasticity may be too low at the forming temperature to maintain the desired shape

Specifications

Temperature Range: -160°C to 600°C
Cooling System: Refrigerator + LN2
Medium Force Capacity
Environmental Chamber
Multiple Clamping Modes (Tension, Compression, Shear)
Frequency Range: 0.01 to 200 Hz

Applications

  • New Product Development
  • Service Temperature Evaluation
  • Failure Investigations
  • Reliability Studies
  • FEA Material Modeling
  • Cure State Analysis

Key Capabilities

  • Storage and loss modulus measurement
  • Tan delta (damping) analysis
  • Glass transition by mechanical method
  • Frequency-temperature superposition
  • Creep and stress relaxation

Need Testing Services?

Contact our R&D team to discuss how we can help with your testing requirements.

Use cases

  • Low-Temperature Seal Design

  • FEA Material Card Development

  • Aging Effect Assessment

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